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About Company

Xi Feng Tin Products Co., Ltd is a distinguished integrated Chinese manufacturer, specializing in the production and distribution of soldering products. With a strong commitment to quality, innovation, and customer satisfaction, XF Solder has positioned ourself as a reliable partner in the soldering industry. Our comprehensive product portfolio includes solder wire, solder bar, and solder paste, catering to the diverse needs of the modern electronics manufacturing & metal joinery sector.

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  • Rich Production Experience
  • Professional Export Service
  • Rich Product Range
  • Good
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  • Reasonable
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SAC305 Solder Paste.jpg
RoHS Compliant Lead Free SAC305 Solder Paste for IC Reballing

RoHS Compliant Lead Free SAC305 Solder Paste is a high-performance solder material designed for IC reballing. In modern electronics manufacturing, IC reballing is an important process used to repair or update the soldering connections of chips.

2024-05-15
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T3 BGA Tin Lead Solder Paste 60 40

T3 Tin-Lead Solder Paste 60/40 is a high-quality soldering material specially designed for BGA (Ball Grid Array) soldering. BGA technology has become one of the mainstream technologies in modern electronic manufacturing, and high-quality soldering materials are crucial to achieving reliable BGA soldering.

2024-05-15
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T4 Surface Mount SMD Tin Solder Paste

T4 Surface Mount SMD Tin Solder Paste has become one of the highly respected soldering materials in the electronics manufacturing industry due to its high-precision particles, excellent fluidity, high temperature stability and environmental reliability.

2024-05-14
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T3 SMT Leaded Tin Solder Paste Sn63Pb37 for LED Manufacturing

T3 SMT Leaded Tin Solder Paste Sn63Pb37 for LED ManufacturingIn today's electronics manufacturing industry, Surface Mount Technology (SMT) has become mainstream. LED (Light Emitting Diode), as the main force of modern lighting and display technology, has extremely high requirements for high-quality

2024-05-13
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Email: xfsolder@163.com
Tel: 008613450770997
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