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 | Tin Lead Solder Paste Sn50Pb50, with an even blend of 50% tin (Sn) and 50% lead (Pb), stands as a versatile soldering material. This solder paste 50 50 simplifies soldering tasks while ensuring reliable connections across various applications.
Sn50Pb50 solder paste is a mixture of solder alloy particles, flux, and binder. It is a crucial component in surface mount technology (SMT) and electronics assembly, facilitating dependable solder connections. |
Alloy Composition | 50% Tin (Sn), 50% Lead (Pb) |
Melting Point | 183-212°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste Packed in Syringe |
Solder Paste Packed in Jar |
Good Performance It has reasonable wetting properties that form strong and reliable solder joints. It provides good mechanical and electrical conductivity, making it suitable for many electronic applications. | Versatility It is compatible with a wide range of surface-mount components, making it versatile for use in various electronic assemblies, including resistors, capacitors, integrated circuits (ICs), and more. | |
Smooth Solder Joints The solder paste 50 50 produces smooth, well-shaped solder joints with low surface tension, reducing the likelihood of defects such as solder bridging. | Cost Saving As solder paste Sn50Pb50 contains lower tin percentage than other solder alloys, it has a much lower cost. It's a nice option for projects that have limited budgets. |
It's mainly used for general repairing works or assembly of medium quality electronics.
Electronics Repairing |
Electronics Manufacturing |
Preparation: Ensure that your work area is clean, well-ventilated, and free of dust and contaminants. Wear appropriate personal protective equipment (PPE), including safety glasses and gloves, to protect against exposure to solder paste and flux.
Stenciling: Place the stencil over the PCB, aligning it with the component footprints. Apply a small amount of Sn50Pb50 solder paste to one edge of the stencil. Scrape excess solder paste off the stencil to leave a consistent layer on the PCB.
Component Placement: Place surface mount components on the PCB, aligning their pads with the solder paste.
Reflow Soldering: Transfer the PCB with components into a reflow oven or appropriate soldering equipment.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
 | Tin Lead Solder Paste Sn50Pb50, with an even blend of 50% tin (Sn) and 50% lead (Pb), stands as a versatile soldering material. This solder paste 50 50 simplifies soldering tasks while ensuring reliable connections across various applications.
Sn50Pb50 solder paste is a mixture of solder alloy particles, flux, and binder. It is a crucial component in surface mount technology (SMT) and electronics assembly, facilitating dependable solder connections. |
Alloy Composition | 50% Tin (Sn), 50% Lead (Pb) |
Melting Point | 183-212°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste Packed in Syringe |
Solder Paste Packed in Jar |
Good Performance It has reasonable wetting properties that form strong and reliable solder joints. It provides good mechanical and electrical conductivity, making it suitable for many electronic applications. | Versatility It is compatible with a wide range of surface-mount components, making it versatile for use in various electronic assemblies, including resistors, capacitors, integrated circuits (ICs), and more. | |
Smooth Solder Joints The solder paste 50 50 produces smooth, well-shaped solder joints with low surface tension, reducing the likelihood of defects such as solder bridging. | Cost Saving As solder paste Sn50Pb50 contains lower tin percentage than other solder alloys, it has a much lower cost. It's a nice option for projects that have limited budgets. |
It's mainly used for general repairing works or assembly of medium quality electronics.
Electronics Repairing |
Electronics Manufacturing |
Preparation: Ensure that your work area is clean, well-ventilated, and free of dust and contaminants. Wear appropriate personal protective equipment (PPE), including safety glasses and gloves, to protect against exposure to solder paste and flux.
Stenciling: Place the stencil over the PCB, aligning it with the component footprints. Apply a small amount of Sn50Pb50 solder paste to one edge of the stencil. Scrape excess solder paste off the stencil to leave a consistent layer on the PCB.
Component Placement: Place surface mount components on the PCB, aligning their pads with the solder paste.
Reflow Soldering: Transfer the PCB with components into a reflow oven or appropriate soldering equipment.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
注: 建议图片大小150px*50px 
