Tin Lead Solder Paste Sn50Pb50, with an even blend of 50% tin (Sn) and 50% lead (Pb), stands as a versatile soldering material. This solder paste 50 50 simplifies soldering tasks while ensuring reliable connections across various applications.
Sn50Pb50 solder paste is a mixture of solder alloy particles, flux, and binder. It is a crucial component in surface mount technology (SMT) and electronics assembly, facilitating dependable solder connections. |
Alloy Composition | 50% Tin (Sn), 50% Lead (Pb) |
Melting Point | 183-212°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. |
Solder Paste Packed in Syringe | Solder Paste Packed in Jar |
Good Performance It has reasonable wetting properties that form strong and reliable solder joints. It provides good mechanical and electrical conductivity, making it suitable for many electronic applications. | Versatility It is compatible with a wide range of surface-mount components, making it versatile for use in various electronic assemblies, including resistors, capacitors, integrated circuits (ICs), and more. | |
Smooth Solder Joints The solder paste 50 50 produces smooth, well-shaped solder joints with low surface tension, reducing the likelihood of defects such as solder bridging. | Cost Saving As solder paste Sn50Pb50 contains lower tin percentage than other solder alloys, it has a much lower cost. It's a nice option for projects that have limited budgets. |
It's mainly used for general repairing works or assembly of medium quality electronics.
Electronics Repairing | Electronics Manufacturing |
Preparation: Ensure that your work area is clean, well-ventilated, and free of dust and contaminants. Wear appropriate personal protective equipment (PPE), including safety glasses and gloves, to protect against exposure to solder paste and flux.
Stenciling: Place the stencil over the PCB, aligning it with the component footprints. Apply a small amount of Sn50Pb50 solder paste to one edge of the stencil. Scrape excess solder paste off the stencil to leave a consistent layer on the PCB.
Component Placement: Place surface mount components on the PCB, aligning their pads with the solder paste.
Reflow Soldering: Transfer the PCB with components into a reflow oven or appropriate soldering equipment.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
Tin Lead Solder Paste Sn50Pb50, with an even blend of 50% tin (Sn) and 50% lead (Pb), stands as a versatile soldering material. This solder paste 50 50 simplifies soldering tasks while ensuring reliable connections across various applications.
Sn50Pb50 solder paste is a mixture of solder alloy particles, flux, and binder. It is a crucial component in surface mount technology (SMT) and electronics assembly, facilitating dependable solder connections. |
Alloy Composition | 50% Tin (Sn), 50% Lead (Pb) |
Melting Point | 183-212°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. |
Solder Paste Packed in Syringe | Solder Paste Packed in Jar |
Good Performance It has reasonable wetting properties that form strong and reliable solder joints. It provides good mechanical and electrical conductivity, making it suitable for many electronic applications. | Versatility It is compatible with a wide range of surface-mount components, making it versatile for use in various electronic assemblies, including resistors, capacitors, integrated circuits (ICs), and more. | |
Smooth Solder Joints The solder paste 50 50 produces smooth, well-shaped solder joints with low surface tension, reducing the likelihood of defects such as solder bridging. | Cost Saving As solder paste Sn50Pb50 contains lower tin percentage than other solder alloys, it has a much lower cost. It's a nice option for projects that have limited budgets. |
It's mainly used for general repairing works or assembly of medium quality electronics.
Electronics Repairing | Electronics Manufacturing |
Preparation: Ensure that your work area is clean, well-ventilated, and free of dust and contaminants. Wear appropriate personal protective equipment (PPE), including safety glasses and gloves, to protect against exposure to solder paste and flux.
Stenciling: Place the stencil over the PCB, aligning it with the component footprints. Apply a small amount of Sn50Pb50 solder paste to one edge of the stencil. Scrape excess solder paste off the stencil to leave a consistent layer on the PCB.
Component Placement: Place surface mount components on the PCB, aligning their pads with the solder paste.
Reflow Soldering: Transfer the PCB with components into a reflow oven or appropriate soldering equipment.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
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