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Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307


Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307

Lead Free Solder Bar

Lead Free Solder Bar Sn99Ag0.3Cu0.7, commonly referred to as solder bar SAC0307, stands as a superior lead-free soldering alloy designed to meet the demands of modern electronics manufacturing. Comprising 99% tin (Sn), 0.3% silver (Ag), and 0.7% copper (Cu), this solder bar offers exceptional performance, reliability, and compliance with environmental regulations. It's an alternative to solder bar SAC305, for reducing the material cost but to keep a good electrical and thermal conductivity.


Specifications of Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307:

Alloy Composition

99% Tin (Sn), 0.3% Silver (Ag), 0.7% Copper (Cu)

Melting Point



20 to 25kgs/box


XF Solder or OEM service


Features of Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307:

Silver Containing

The silver adds up the electrical conductivity of the solder bar, making it's suitable for higher end electronics manufacturing.

Reliable Quality

Solder bar SAC0307 presents excellent wetting property and high strength property. The solder joints produced by it are very strong and can last for long time.

Reduced Cost

As the silver is much lower than solder bar SAC305, it has a more affordable price, to make it suitable for most general manufacturing.


The solder bar Sn99Ag0.3Cu0.7 is compatible with most flux used for electronics manufacturing, making it handy to be used.


Applications of Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307:

Solder Bar SAC0307 is used for assembly of electronics components which requires RoHS compliant. Commonly the IC components are insert into the PCB and then we use the molten solder bar to assemble them by dip soldering or wave soldering. We call this process the THT (through holes technology).


We also use this solder bar for tinning electrical wires or pins of IC components, for enhancing the electrical conductivity and get them to be easier for further assembly.

Wire Tinning with solder bar

Metal Tinning

Dip Soldering with solder bar

PCB Dip Soldering

wave soldering with solder bar

PCB Wave Soldering


How to use Lead Free Solder Bar Sn99Ag0.3Cu0.7 SAC0307?

Method 1: by dip soldering:

Use solder pots to melt the solder bar SAC0307 and get the solder remains at the correct temperature. And them put the assembled PCB board (THT) to go through flux pot to get tbe bottom side of the board well dipped with wet flux. Then move the PCB board to the solder pot and let the bottom side of PCB board well touched with the molten solder. With the help of the flux, the solder will cover the pins and pad evenly.


Method 2: by wave soldering:

We will need the professional wave soldering machine to do this process. As the spraying of flux and the soldering will all be automatically done, it's more accurate and higher output. The wave soldering machine has conveyors to carry the assembled PCB to go through the flux processing and send it to the wave soldering sector.


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