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| Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 is a high-quality soldering material that has a precise composition of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu). This solder paste is designed to meet modern environmental regulations while maintaining excellent soldering properties. Lead free solder paste is the first option for applications whereas lead containing is prohibited.
Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 is formulated with a carefully selected combination of solder powders, flux, and binder. The addition of 3% silver to the Sn-Cu alloy enhances the joint strength, thermal conductivity, and overall reliability of soldered connections. |
Alloy Composition | 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu) |
Melting Point | 217-220°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce this solder paste in syringe. | |
Solder Paste Packing in Jar |
Solder Paste Packing in Syringe |
Excellent Performance The solder paste Sn96.5Ag3.0Cu0.5 can produce bright, firm and high mechanical strength solder joints, contributing to the overall reliability of soldered connections. | Silver Containing Silver enhances the thermal conductivity and electrical conductivity of the solder paste, allowing for better heat dissipation and better electrical performance on components. | |
RoHS Compliance The SAC305 solder paste doesn't contain lead, making it environmentally friendly and compliant with modern regulations. | Good Viscosity This solder paste has good viscosity, making it easy to print onto the pads and stay in a good shape during the soldering process. |
This solder paste SAC305 is primarily used for electronics manufacturing by surface mount technology (SMT) and through-hole soldering. Including:
Consumer Electronics: It finds application in the production of consumer electronics such as refrigerators, smartphones, tablets, laptops, and gaming devices.
Automotive Electronics: The solder paste is suitable for soldering critical components in automotive electronics systems.
Hand Printing Soldering |
Jet Printing Soldering |
Automatic Reflow Soldering |
Stencil Printing: Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB).
Place SMD components: Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers.
Conduct the Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
| Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 is a high-quality soldering material that has a precise composition of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu). This solder paste is designed to meet modern environmental regulations while maintaining excellent soldering properties. Lead free solder paste is the first option for applications whereas lead containing is prohibited.
Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 is formulated with a carefully selected combination of solder powders, flux, and binder. The addition of 3% silver to the Sn-Cu alloy enhances the joint strength, thermal conductivity, and overall reliability of soldered connections. |
Alloy Composition | 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu) |
Melting Point | 217-220°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce this solder paste in syringe. | |
Solder Paste Packing in Jar |
Solder Paste Packing in Syringe |
Excellent Performance The solder paste Sn96.5Ag3.0Cu0.5 can produce bright, firm and high mechanical strength solder joints, contributing to the overall reliability of soldered connections. | Silver Containing Silver enhances the thermal conductivity and electrical conductivity of the solder paste, allowing for better heat dissipation and better electrical performance on components. | |
RoHS Compliance The SAC305 solder paste doesn't contain lead, making it environmentally friendly and compliant with modern regulations. | Good Viscosity This solder paste has good viscosity, making it easy to print onto the pads and stay in a good shape during the soldering process. |
This solder paste SAC305 is primarily used for electronics manufacturing by surface mount technology (SMT) and through-hole soldering. Including:
Consumer Electronics: It finds application in the production of consumer electronics such as refrigerators, smartphones, tablets, laptops, and gaming devices.
Automotive Electronics: The solder paste is suitable for soldering critical components in automotive electronics systems.
Hand Printing Soldering |
Jet Printing Soldering |
Automatic Reflow Soldering |
Stencil Printing: Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB).
Place SMD components: Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers.
Conduct the Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
注: 建议图片大小150px*50px 
