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 | Low Temperature Tin Bismuth Solder Wire Sn42Bi58 is a noteworthy advancement in soldering technology, offering a lead-free solution with a low temperature melting point. Comprising 42% tin (Sn) and 58% bismuth (Bi), this solder alloy provides an excellent choice for applications requiring lead-free soldering and low temperature to work with. It's suitable for soldering heat senstive components or workpieces. |
Alloy Composition | 42% Tin (Sn), 58% Bismuth (Bi) |
Melting Point | 138°C |
Flux Core Type | Solid wire without flux |
Weight | 100g/roll, 200g/roll, 500g/roll, 1kg/roll or as required |
Wire Diameter | From 0.5mm to 3.2mm |
Brand | XF Solder or OEM service |
Various Package Sizes |
Various Wire Diameters |
Lead Free Solution Sn42Bi58 solder wire is designed to offer a lead-free alternative, adhering to global initiatives for sustainable and environmentally friendly soldering practices. | Low Melting Point The solder's composition results in a low melting point, making it suitable for soldering applications that involve heat-sensitive components. | |
Reduced Thermal Stress Sn42Bi58 solder wire's lower melting point contributes to minimizing thermal stress on delicate components during soldering. | Various Sizes Thi low temperature solder wire is available in different wire diameters; it provides flexibility for users to choose a proper wire diameter for their tasks. |
Manual PCB Assembly |
Automatic PCB Assembly |
As the specialty of this tin bismuth solder wire is its low temperature melting point, it's the perfect solutions for assembling the heat sensitive electronic components. It requires much less heat for this low temperature solder wire to melt when comparing to most of the other solder alloys. Typical uses are products of: semiconductors, optoelectronic components, sensors, batteries etc.
Users must prepare compatible external flux because this tin bismuth solder wire comes in solid wire without flux core.
Use the right soldering temperature as this low temperature solder wire doesn't need much heat to melt.
 | Low Temperature Tin Bismuth Solder Wire Sn42Bi58 is a noteworthy advancement in soldering technology, offering a lead-free solution with a low temperature melting point. Comprising 42% tin (Sn) and 58% bismuth (Bi), this solder alloy provides an excellent choice for applications requiring lead-free soldering and low temperature to work with. It's suitable for soldering heat senstive components or workpieces. |
Alloy Composition | 42% Tin (Sn), 58% Bismuth (Bi) |
Melting Point | 138°C |
Flux Core Type | Solid wire without flux |
Weight | 100g/roll, 200g/roll, 500g/roll, 1kg/roll or as required |
Wire Diameter | From 0.5mm to 3.2mm |
Brand | XF Solder or OEM service |
Various Package Sizes |
Various Wire Diameters |
Lead Free Solution Sn42Bi58 solder wire is designed to offer a lead-free alternative, adhering to global initiatives for sustainable and environmentally friendly soldering practices. | Low Melting Point The solder's composition results in a low melting point, making it suitable for soldering applications that involve heat-sensitive components. | |
Reduced Thermal Stress Sn42Bi58 solder wire's lower melting point contributes to minimizing thermal stress on delicate components during soldering. | Various Sizes Thi low temperature solder wire is available in different wire diameters; it provides flexibility for users to choose a proper wire diameter for their tasks. |
Manual PCB Assembly |
Automatic PCB Assembly |
As the specialty of this tin bismuth solder wire is its low temperature melting point, it's the perfect solutions for assembling the heat sensitive electronic components. It requires much less heat for this low temperature solder wire to melt when comparing to most of the other solder alloys. Typical uses are products of: semiconductors, optoelectronic components, sensors, batteries etc.
Users must prepare compatible external flux because this tin bismuth solder wire comes in solid wire without flux core.
Use the right soldering temperature as this low temperature solder wire doesn't need much heat to melt.
注: 建议图片大小150px*50px 
