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| Tin Lead Solder Paste Sn63Pb37, composed of 63% tin (Sn) and 37% lead (Pb), represents a conventional soldering material that has been widely used in electronics assembly for decades. It’s also known as Solder Paste 63 37. This paste simplifies the soldering process and creates reliable connections in various applications for it's accurate printing and soldering effect.
Sn63Pb37 solder paste is a carefully formulated mixture of solder alloy particles, flux, and binder. It plays a crucial role in surface mount technology (SMT) and electronics assembly, ensuring strong and dependable soldering connections. |
Alloy Composition | 63% Tin (Sn), 37% Lead (Pb) |
Melting Point | 183°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste in Jars |
Solder Paste in Syringes |
Eutectic Alloy Sn63Pb37 tin lead solder paste forms a eutectic alloy that has melting temperature and solidifying temperature at same temperature, ensuring reliable soldering outcomes. That means it has a single low melting point, minimizing the risk of temperature variations during soldering. | Reliable Performance Solder paste 63 37 consistently produces robust solder joints with desirable thermal and mechanical properties. The solder joints made from it are bright, strong and with excellent electrical conductivity. And our solder powder sizes are well controlled, making the soldering work accurate and high efficiency. | |
High Compatibility The paste includes a rosin-based flux that cleans surfaces, improves wetting, and forms strong solder joints. And our rosin flux is a non-aggressive flux type, which is suitable for most electronic assembly projects. | Low Surface Tension The low surface tension of solder paste 63 37 allows it to form smooth and consistent solder joints, reducing the likelihood of defects like solder bridging or tombstoning. |
Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.
Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.
It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.
General soldering and repairing works for small projects or for hobbyist.
Manual SMT Soldering |
Automatic SMT Soldering |
Manual Soldering |
Stencil Printing: Prepare and clean stencil and PCB properly. Using a squeegee, a stencil printer, or a similar tool, apply the solder paste 63 37 over the stencil, allowing the paste to be pushed through the openings and onto the PCB pads. Apply even pressure to ensure consistent solder paste deposition.
Place IC Components: Precisely place surface mount components onto the solder paste-covered pads. Ensure that the component leads or pads align correctly with the solder paste deposits.
Reflow Soldering: Place the PCB with the components onto a conveyor belt in a reflow oven or onto a hot plate for reflow soldering. The reflow process involves heating the PCB to melt the solder paste 63 37 and create solder joints. Follow the reflowing manual for reflow temperature profiles and times.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
| Tin Lead Solder Paste Sn63Pb37, composed of 63% tin (Sn) and 37% lead (Pb), represents a conventional soldering material that has been widely used in electronics assembly for decades. It’s also known as Solder Paste 63 37. This paste simplifies the soldering process and creates reliable connections in various applications for it's accurate printing and soldering effect.
Sn63Pb37 solder paste is a carefully formulated mixture of solder alloy particles, flux, and binder. It plays a crucial role in surface mount technology (SMT) and electronics assembly, ensuring strong and dependable soldering connections. |
Alloy Composition | 63% Tin (Sn), 37% Lead (Pb) |
Melting Point | 183°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste in Jars |
Solder Paste in Syringes |
Eutectic Alloy Sn63Pb37 tin lead solder paste forms a eutectic alloy that has melting temperature and solidifying temperature at same temperature, ensuring reliable soldering outcomes. That means it has a single low melting point, minimizing the risk of temperature variations during soldering. | Reliable Performance Solder paste 63 37 consistently produces robust solder joints with desirable thermal and mechanical properties. The solder joints made from it are bright, strong and with excellent electrical conductivity. And our solder powder sizes are well controlled, making the soldering work accurate and high efficiency. | |
High Compatibility The paste includes a rosin-based flux that cleans surfaces, improves wetting, and forms strong solder joints. And our rosin flux is a non-aggressive flux type, which is suitable for most electronic assembly projects. | Low Surface Tension The low surface tension of solder paste 63 37 allows it to form smooth and consistent solder joints, reducing the likelihood of defects like solder bridging or tombstoning. |
Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.
Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.
It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.
General soldering and repairing works for small projects or for hobbyist.
Manual SMT Soldering |
Automatic SMT Soldering |
Manual Soldering |
Stencil Printing: Prepare and clean stencil and PCB properly. Using a squeegee, a stencil printer, or a similar tool, apply the solder paste 63 37 over the stencil, allowing the paste to be pushed through the openings and onto the PCB pads. Apply even pressure to ensure consistent solder paste deposition.
Place IC Components: Precisely place surface mount components onto the solder paste-covered pads. Ensure that the component leads or pads align correctly with the solder paste deposits.
Reflow Soldering: Place the PCB with the components onto a conveyor belt in a reflow oven or onto a hot plate for reflow soldering. The reflow process involves heating the PCB to melt the solder paste 63 37 and create solder joints. Follow the reflowing manual for reflow temperature profiles and times.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
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