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| Solder Paste Sn62.8Pb36.8Ag0.4 is blended with 62.8% tin (Sn), 36.8% lead (Pb), and 0.4% silver (Ag). It's a grey color paste form product. And it offers a unique combination of properties that are advantageous in various electronics assembly applications.
Sn62.8Pb36.8Ag0.4 solder paste is a precisely formulated mixture of solder powders, flux, and binder. The addition of 0.4% silver to the traditional tin lead alloy enhances the electrical conductivity and strength of solder joints, making it suitable for applications that demand both good electrical performance and mechanical reliability. |
Alloy Composition | 62.8% Tin (Sn), 36.8% Lead (Pb), 0.4% Silver (Ag) |
Melting Point | 179-183°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste Syringe |
Solder Pastse Jar |
Good Conductivity Adding 0.4% silver has improved the electrical conductivity of solder joints. For products that require a good electrical performance, this solder paste is ideal to be used. | High Reliability The tin lead silver solder paste brings to the solder joint good bonding strength in electronic assemblies. It firmly binds the electronic components onto PCB without leakage or short-circuit. | |
Lower Melting Point The alloy has a relatively low melting point compared to other solder alloys, making it suitable for soldering applications that require less heat. The melting point is typically around 183°C. | Affordable Price Comparing to solder paste Sn62Pb36Ag2 type, the Sn62.8Pb36.8Ag0.4 solder paste contains lower percentage of silver which greatly reduces its cost. But it still keeps a reasonable performance. |
Solder Paste Sn62.8Pb36.8Ag0.4 is mainly used for SMT (surface mount technology) of electronics assembly. It is done by hot air gun or reflow oven.
Electronics Assembly: Sn62.8Pb36.8Ag0.4 solder paste is used in applications where both electrical conductivity and mechanical strength are paramount.
Repair and Rework: In situations where legacy electronic assemblies need repair or rework, technicians might use Sn62.8Pb36.8Ag0.4 solder paste to maintain compatibility with the original solder joints.
Jet Printing of Solder Paste |
Auto Printing of Solder Paste |
Hand Printing of Solder Paste |
Stencil Printing: Clean the PCB properly or the soldering area properly. Put stencil accurately on to PCB and make sure the stencil matches the solder pads well. Apply tin lead silver solder paste through a stencil onto designated solder pads on a printed circuit board (PCB).
Component Placement: If you're manually placing components, carefully position them on the solder paste-covered pads. Ensure proper alignment and orientation. In automated assembly processes, a pick-and-place machine is used to accurately place components on the solder paste-covered pads.
Reflow Soldering: Place the assembled PCB into a reflow oven or reflow soldering equipment. The oven's temperature profile will follow a specific heating and cooling curve, allowing the solder paste to melt, form solder joints, and solidify. Or you use manual hot air gun, make sure you deliver the correct heat and keep observation of how the solder paste performs during the soldering work.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
| Solder Paste Sn62.8Pb36.8Ag0.4 is blended with 62.8% tin (Sn), 36.8% lead (Pb), and 0.4% silver (Ag). It's a grey color paste form product. And it offers a unique combination of properties that are advantageous in various electronics assembly applications.
Sn62.8Pb36.8Ag0.4 solder paste is a precisely formulated mixture of solder powders, flux, and binder. The addition of 0.4% silver to the traditional tin lead alloy enhances the electrical conductivity and strength of solder joints, making it suitable for applications that demand both good electrical performance and mechanical reliability. |
Alloy Composition | 62.8% Tin (Sn), 36.8% Lead (Pb), 0.4% Silver (Ag) |
Melting Point | 179-183°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste Syringe |
Solder Pastse Jar |
Good Conductivity Adding 0.4% silver has improved the electrical conductivity of solder joints. For products that require a good electrical performance, this solder paste is ideal to be used. | High Reliability The tin lead silver solder paste brings to the solder joint good bonding strength in electronic assemblies. It firmly binds the electronic components onto PCB without leakage or short-circuit. | |
Lower Melting Point The alloy has a relatively low melting point compared to other solder alloys, making it suitable for soldering applications that require less heat. The melting point is typically around 183°C. | Affordable Price Comparing to solder paste Sn62Pb36Ag2 type, the Sn62.8Pb36.8Ag0.4 solder paste contains lower percentage of silver which greatly reduces its cost. But it still keeps a reasonable performance. |
Solder Paste Sn62.8Pb36.8Ag0.4 is mainly used for SMT (surface mount technology) of electronics assembly. It is done by hot air gun or reflow oven.
Electronics Assembly: Sn62.8Pb36.8Ag0.4 solder paste is used in applications where both electrical conductivity and mechanical strength are paramount.
Repair and Rework: In situations where legacy electronic assemblies need repair or rework, technicians might use Sn62.8Pb36.8Ag0.4 solder paste to maintain compatibility with the original solder joints.
Jet Printing of Solder Paste |
Auto Printing of Solder Paste |
Hand Printing of Solder Paste |
Stencil Printing: Clean the PCB properly or the soldering area properly. Put stencil accurately on to PCB and make sure the stencil matches the solder pads well. Apply tin lead silver solder paste through a stencil onto designated solder pads on a printed circuit board (PCB).
Component Placement: If you're manually placing components, carefully position them on the solder paste-covered pads. Ensure proper alignment and orientation. In automated assembly processes, a pick-and-place machine is used to accurately place components on the solder paste-covered pads.
Reflow Soldering: Place the assembled PCB into a reflow oven or reflow soldering equipment. The oven's temperature profile will follow a specific heating and cooling curve, allowing the solder paste to melt, form solder joints, and solidify. Or you use manual hot air gun, make sure you deliver the correct heat and keep observation of how the solder paste performs during the soldering work.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
注: 建议图片大小150px*50px 
