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 | Tin Lead Silver Solder Paste Sn62Pb36Ag2 is a specialized soldering material composed of 62% tin (Sn), 36% lead (Pb), and 2% silver (Ag). This tin lead silver solder paste offers a unique blend of properties that make it ideal for specific applications where enhanced conductivity and strength are essential.
Sn62Pb36Ag2 solder paste is formulated with solder powders, flux, and binder. The addition of 2% silver to the traditional tin lead alloy brings improved electrical conductivity and joint strength, making it suitable for applications demanding superior electrical performance and mechanical reliability. |
Alloy Composition | 62% Tin (Sn), 36% Lead (Pb), 2% Silver (Ag) |
Melting Point | 179°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste Jar |
Solder Paste Syringe |
Enhanced Conductivity The adding of 2% silver significantly enhances the electrical conductivity of solder joints, making it suitable for applications that require efficient current flow. | Improved Strength The silver also increases the joint strength, enhancing the overall mechanical reliability of solder connections. | |
Effective Flux Sn62Pb36Ag2 solder paste contains rosin-based flux, it helps to clean the surface and makes solder powders well melt and to flow evenly on the solder joints. | Lower Melting Point As the melting point of solder paste Sn62Pb36Ag2 is only 179℃, which is lower comparing to other leaded solder paste alloys. This makes it much easier to work with. |
The Tin Lead Silver Solder Paste Sn62Pb36Ag2 mainly used for manufacturing of electronics & electrical equipment, such as PCB assembly & components joinery. It's generally used for Surface Mount Technology (SMT) soldering to connect SMD (surface mount device) components to the surface of PCBs by reflow soldering process or hot hair gun. It provides possibility to operate on small and accurate PCB with high productivity.
Repair and Rework: Sn62Pb36Ag2 solder paste can be used for repairing or reworking electronic assemblies, especially when matching the existing solder alloy is necessary to maintain compatibility and performance.
Solder Paste Manual Printing |
Solder Paste Automatic Printing |
Solder Paste Jet Printing |
The application method of solder paste is SMT (surface mount technology), and done through hot hair gun or reflow soldering.
1. Stencil Printing: Apply tin lead silver solder paste through a stencil onto designated solder pads on a printed circuit board (PCB).
2. Component Placement: Accurately place surface mount components onto the solder paste-covered pads.
3. Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering.
Storage: It is recommended to store the solder paste at temperature between 2°C to 10°C in refrigerators or cold room, to prevent paste drying or degradation.
Using: It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
| Tin Lead Silver Solder Paste Sn62Pb36Ag2 is a specialized soldering material composed of 62% tin (Sn), 36% lead (Pb), and 2% silver (Ag). This tin lead silver solder paste offers a unique blend of properties that make it ideal for specific applications where enhanced conductivity and strength are essential.
Sn62Pb36Ag2 solder paste is formulated with solder powders, flux, and binder. The addition of 2% silver to the traditional tin lead alloy brings improved electrical conductivity and joint strength, making it suitable for applications demanding superior electrical performance and mechanical reliability. |
Alloy Composition | 62% Tin (Sn), 36% Lead (Pb), 2% Silver (Ag) |
Melting Point | 179°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce the solder paste in syringe. | |
Solder Paste Jar |
Solder Paste Syringe |
Enhanced Conductivity The adding of 2% silver significantly enhances the electrical conductivity of solder joints, making it suitable for applications that require efficient current flow. | Improved Strength The silver also increases the joint strength, enhancing the overall mechanical reliability of solder connections. | |
Effective Flux Sn62Pb36Ag2 solder paste contains rosin-based flux, it helps to clean the surface and makes solder powders well melt and to flow evenly on the solder joints. | Lower Melting Point As the melting point of solder paste Sn62Pb36Ag2 is only 179℃, which is lower comparing to other leaded solder paste alloys. This makes it much easier to work with. |
The Tin Lead Silver Solder Paste Sn62Pb36Ag2 mainly used for manufacturing of electronics & electrical equipment, such as PCB assembly & components joinery. It's generally used for Surface Mount Technology (SMT) soldering to connect SMD (surface mount device) components to the surface of PCBs by reflow soldering process or hot hair gun. It provides possibility to operate on small and accurate PCB with high productivity.
Repair and Rework: Sn62Pb36Ag2 solder paste can be used for repairing or reworking electronic assemblies, especially when matching the existing solder alloy is necessary to maintain compatibility and performance.
Solder Paste Manual Printing |
Solder Paste Automatic Printing |
Solder Paste Jet Printing |
The application method of solder paste is SMT (surface mount technology), and done through hot hair gun or reflow soldering.
1. Stencil Printing: Apply tin lead silver solder paste through a stencil onto designated solder pads on a printed circuit board (PCB).
2. Component Placement: Accurately place surface mount components onto the solder paste-covered pads.
3. Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering.
Storage: It is recommended to store the solder paste at temperature between 2°C to 10°C in refrigerators or cold room, to prevent paste drying or degradation.
Using: It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
注: 建议图片大小150px*50px 
