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| Lead Free Solder Bar Sn96.5Ag3.0Cu0.5, often referred to as Solder Bar SAC305. Composed of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu), this solder bar is designed to meet modern environmental regulations while maintaining reliable soldering performance. It is an ideal alternative to traditional lead-containing solder. It's generally used by wave soldering and dip soldering, for the purpose of enhancing manufacturing capacity. It's a high-end solder bar that contains silver in it, improving the electrical conductivity and resistance to thermal fatigue. It's suitable to be used for high precision and high-quality requirement projects. |
Alloy Composition | 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu) |
Melting Point | 217-220°C |
Packing | 20 to 25kgs/box |
Brand | XF Solder or OEM service |
Good Wettability SAC305 solder presents excellent wettability. It spreads evenly and adheres to the metal surfaces it comes into contact with. | Electrical Conductivity SAC305 solder contains 3% silver, which greatly enhance its electrical conductivity, suitable for high precision soldering. | |
Strength and Durability The addition of copper to this alloy improves its mechanical strength and durability. That ensures that the solder forms a strong and reliable bond with the components being joined. | Lead Free Solution Sn96.5Ag3.0Cu0.5 solder bar doesn't contain lead and it is RoHS compliant. It can be used for applications that need to comply with environmentally conscious manufacturing practices and regulations. |
Manufacturing of Electronics and Electrical Equipment. Mainly it's for assembly of PCB with THT (through holes technology), either by using dip soldering or wave soldering. Such as home appliances, automotive industry equipment & system etc.
It's used for tinning wires, electronics components, for the purpose getting these components more suitable for further assembly and also to enhance the electrical conductivity.
It's used for tinning metal workpiece, for the purpose of protecting the metal surface from being oxidized or rusted.
Tinning with Solder Bar |
Dip Soldering with Solder Bar |
Wave Soldering with Solder Bar |
Dip soldering:
Put solder bar SAC305 into a solder pot and let the bars melt into liquid form and stays in a correct proper temperature.
Put the electronics components on to a PCB by using through hole technology.
Dip the bottom side of the PCB which has those IC components on it into the flux pot to get flux on to the PCB. The flux helps the solder to wet the pads and leads, and prevents oxidation.
Lower the PCB into the solder pot starting from one end until it is flat, and then lifted up from the same end. The total time in the solder should be a few seconds, otherwise the board or the components may be damaged.
Wave soldering:
Melt the solder bar Sn96.5Ag3.0Cu0.5 in the wave soldering machine.
Assembled the IC components on the PCB.
Send the assembled PCB onto the conveyor and it will go through the flux spraying to get wet flux on the back side of the PCB.
Then the PCB will be moved to the wave soldering sector. The nozzle will create the wave of solder to contact the bottom of the board and fills the holes and pads. The PCB board is then cooled and cleaned.
| Lead Free Solder Bar Sn96.5Ag3.0Cu0.5, often referred to as Solder Bar SAC305. Composed of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu), this solder bar is designed to meet modern environmental regulations while maintaining reliable soldering performance. It is an ideal alternative to traditional lead-containing solder. It's generally used by wave soldering and dip soldering, for the purpose of enhancing manufacturing capacity. It's a high-end solder bar that contains silver in it, improving the electrical conductivity and resistance to thermal fatigue. It's suitable to be used for high precision and high-quality requirement projects. |
Alloy Composition | 96.5% Tin (Sn), 3.0% Silver (Ag), 0.5% Copper (Cu) |
Melting Point | 217-220°C |
Packing | 20 to 25kgs/box |
Brand | XF Solder or OEM service |
Good Wettability SAC305 solder presents excellent wettability. It spreads evenly and adheres to the metal surfaces it comes into contact with. | Electrical Conductivity SAC305 solder contains 3% silver, which greatly enhance its electrical conductivity, suitable for high precision soldering. | |
Strength and Durability The addition of copper to this alloy improves its mechanical strength and durability. That ensures that the solder forms a strong and reliable bond with the components being joined. | Lead Free Solution Sn96.5Ag3.0Cu0.5 solder bar doesn't contain lead and it is RoHS compliant. It can be used for applications that need to comply with environmentally conscious manufacturing practices and regulations. |
Manufacturing of Electronics and Electrical Equipment. Mainly it's for assembly of PCB with THT (through holes technology), either by using dip soldering or wave soldering. Such as home appliances, automotive industry equipment & system etc.
It's used for tinning wires, electronics components, for the purpose getting these components more suitable for further assembly and also to enhance the electrical conductivity.
It's used for tinning metal workpiece, for the purpose of protecting the metal surface from being oxidized or rusted.
Tinning with Solder Bar |
Dip Soldering with Solder Bar |
Wave Soldering with Solder Bar |
Dip soldering:
Put solder bar SAC305 into a solder pot and let the bars melt into liquid form and stays in a correct proper temperature.
Put the electronics components on to a PCB by using through hole technology.
Dip the bottom side of the PCB which has those IC components on it into the flux pot to get flux on to the PCB. The flux helps the solder to wet the pads and leads, and prevents oxidation.
Lower the PCB into the solder pot starting from one end until it is flat, and then lifted up from the same end. The total time in the solder should be a few seconds, otherwise the board or the components may be damaged.
Wave soldering:
Melt the solder bar Sn96.5Ag3.0Cu0.5 in the wave soldering machine.
Assembled the IC components on the PCB.
Send the assembled PCB onto the conveyor and it will go through the flux spraying to get wet flux on the back side of the PCB.
Then the PCB will be moved to the wave soldering sector. The nozzle will create the wave of solder to contact the bottom of the board and fills the holes and pads. The PCB board is then cooled and cleaned.
注: 建议图片大小150px*50px 
