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 | Lead Free Solder Paste Sn99Ag0.3Cu0.7 is a specialized soldering material that combines lead free characteristics with a carefully balanced composition of 99% tin (Sn), 0.3% silver (Ag), and 0.7% copper (Cu). This solder paste SAC0307 is designed to provide exceptional soldering performance while adhering to modern environmental regulations.
Lead Free Solder Paste SAC0307 is formulated with solder alloy particles, flux, and binder. The inclusion of 0.3% silver in the composition enhances the joint strength, thermal cycling reliability, and overall performance of soldered connections. |
Alloy Composition | 99% tin (Sn), 0.3% silver (Ag), and 0.7% copper (Cu) |
Melting Point | 217-227°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce this solder paste in syringe. | |
Packed in Jars |
Packed in Syringe |
Reliable Quality The solder paste SAC0307 has good mechanical strength and durability of solder joints, ensuring long-term reliability. | Thermal Cycling Performance Silver & copper contribute to enhanced thermal cycling performance, making this solder paste suitable for applications that experience temperature variations. | |
Lead-Free Compliance With no lead content, this solder paste SAC0307 aligns with global efforts to reduce hazardous materials in manufacturing processes. | Affordable Price This solder paste contains only 0.3% silver, making it much cheaper than alloy SAC305. But it still keeps a reasonably good soldering performance. |
Solder Paste Sn99Ag0.3Cu0.7 is used for electronics assembly. Commonly we see it being used for PCB assembly, LED lighting assembly, smartphones, tablets, and wearables etc. The main methods to use solder paste is through surface mount technology (SMT) and through-hole soldering.
Solder Paste Jet Printing |
Solder Passte Hand Printing |
Solder Paste Syringe Manually |
Paste Printing: Clean the stencil and place it accurately on to PCB to match the solder pads position. Apply solder paste through the stencil to get proper amount of solder paste stuck on the pads.
Laying of Component: Precisely put surface mount components onto the solder paste-covered pads. For big projects it's recommended to use automatic printing machine, for small projects it's okay to use manual printing.
Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. It's generally conducted by automatic reflow production line or reflow oven.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
| Lead Free Solder Paste Sn99Ag0.3Cu0.7 is a specialized soldering material that combines lead free characteristics with a carefully balanced composition of 99% tin (Sn), 0.3% silver (Ag), and 0.7% copper (Cu). This solder paste SAC0307 is designed to provide exceptional soldering performance while adhering to modern environmental regulations.
Lead Free Solder Paste SAC0307 is formulated with solder alloy particles, flux, and binder. The inclusion of 0.3% silver in the composition enhances the joint strength, thermal cycling reliability, and overall performance of soldered connections. |
Alloy Composition | 99% tin (Sn), 0.3% silver (Ag), and 0.7% copper (Cu) |
Melting Point | 217-227°C |
Flux Type | Rosin based flux |
Powder Size | Type 3 (25-45μm), Type 4 (20-38μm) |
Shelf Life | Recommended 6months |
Weight | 500g/jar |
Brand | XF Solder or OEM service |
*We also produce this solder paste in syringe. | |
Packed in Jars |
Packed in Syringe |
Reliable Quality The solder paste SAC0307 has good mechanical strength and durability of solder joints, ensuring long-term reliability. | Thermal Cycling Performance Silver & copper contribute to enhanced thermal cycling performance, making this solder paste suitable for applications that experience temperature variations. | |
Lead-Free Compliance With no lead content, this solder paste SAC0307 aligns with global efforts to reduce hazardous materials in manufacturing processes. | Affordable Price This solder paste contains only 0.3% silver, making it much cheaper than alloy SAC305. But it still keeps a reasonably good soldering performance. |
Solder Paste Sn99Ag0.3Cu0.7 is used for electronics assembly. Commonly we see it being used for PCB assembly, LED lighting assembly, smartphones, tablets, and wearables etc. The main methods to use solder paste is through surface mount technology (SMT) and through-hole soldering.
Solder Paste Jet Printing |
Solder Passte Hand Printing |
Solder Paste Syringe Manually |
Paste Printing: Clean the stencil and place it accurately on to PCB to match the solder pads position. Apply solder paste through the stencil to get proper amount of solder paste stuck on the pads.
Laying of Component: Precisely put surface mount components onto the solder paste-covered pads. For big projects it's recommended to use automatic printing machine, for small projects it's okay to use manual printing.
Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. It's generally conducted by automatic reflow production line or reflow oven.
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
注: 建议图片大小150px*50px 
