T3 SMT Paste Solder 63/37 Sn63Pb37 500g/bottle for PCB Printing 

Introduction

When it comes to PCB printing, the quality of SMT solder plays a crucial role in ensuring strong, reliable connections. The T3 SMT Paste Solder 63/37 Sn63Pb37 500g/bottle is a premium-grade SMT paste solder designed for precision soldering in surface-mount technology (SMT) applications. With its optimal 63/37 tin-lead (Sn63Pb37) composition, this solder paste ensures excellent wetting properties, strong adhesion, and minimal defects in PCB assemblies.

In this detailed product guide, we will explore two key aspects of this SMT solder for PCB printing:

1. Superior Composition & Performance Benefits

2. Optimal Applications & Usage Guidelines

By the end, you’ll understand why the T3 SMT solder 63/37 is a top choice for professionals in electronics manufacturing.

1. Superior Composition & Performance Benefits of T3 SMT Solder Sn63Pb37

High-Quality 63/37 Alloy for Reliable PCB Printing

The T3 SMT solder 63/37 is formulated with a precise Sn63Pb37 alloy ratio, which is widely regarded as the eutectic solder composition. This means it has a sharp melting point at 183°C (361°F), ensuring:

• Faster solidification – Reduces the risk of cold joints and bridging.

• Excellent wetting properties – Enhances solder flow for strong PCB connections.

• Minimal voids & defects – Improves electrical conductivity and mechanical strength.

Compared to non-eutectic solder pastes, the SMT solder Sn63Pb37 ensures consistent performance, making it ideal for high-precision PCB printing applications.

T3 Classification – Fine Particle Size for Precision Soldering

The T3 SMT paste solder features a Type 3 (T3) particle size distribution, with solder powder particles ranging between 25-45 microns. This classification offers:

• Superior printability – Ideal for stencil printing with fine-pitch components (0201, 0.4mm pitch ICs).

• Reduced clogging – Ensures smooth dispensing through stencil apertures.

• Enhanced tackiness – Keeps components in place before reflow soldering.

Whether you're working on consumer electronics, automotive PCBs, or industrial control systems, the T3 SMT solder for PCB printing delivers unmatched precision.

500g/Bottle – Convenient Packaging for Efficient Use

The SMT solder 500g/bottle packaging is designed for:

• Easy storage – Sealed bottles prevent oxidation and maintain solder paste freshness.

• Controlled dispensing – Minimizes waste and ensures consistent application.

• Cost-effective usage – Ideal for medium to large-scale PCB assembly operations.

2. Optimal Applications & Usage Guidelines for SMT Paste Solder 63/37

Best Uses for T3 SMT Solder Sn63Pb37

The T3 SMT solder 63/37 is highly versatile and suitable for:

• Surface-Mount Technology (SMT) Assembly – Perfect for attaching fine-pitch components like resistors, capacitors, and BGAs.

• Reflow Soldering Processes – Works efficiently in convection, infrared, and vapor phase reflow ovens.

• Prototyping & Mass Production – Used in both small-scale PCB prototyping and high-volume manufacturing.

Step-by-Step Guide: How to Use T3 SMT Paste Solder for PCB Printing

Step 1: Storage & Handling

• Store the SMT solder 500g/bottle in a refrigerator (2-10°C) to extend shelf life.

• Before use, allow the paste to reach room temperature (approx. 2-4 hours) to avoid condensation.

Step 2: Stencil Printing

• Use a stainless steel stencil (thickness: 0.1-0.15mm) for precise solder deposition.

• Apply the SMT paste solder evenly using a squeegee (60° angle recommended).

Step 3: Component Placement

• Place SMD components onto the solder paste within 4-8 hours of printing to prevent drying.

Step 4: Reflow Soldering

• Preheat: 150-180°C (ramp rate: 1-2°C/sec)

• Soak: 60-90 seconds at 150-180°C

• Reflow: Peak temperature 220-240°C for 30-60 seconds

• Cooling: Gradual cooling (1-3°C/sec) to solidify joints properly

Post-Soldering Inspection & Cleaning

• Check for bridging, insufficient solder, or misaligned components.

• Clean residues (if needed) using a no-clean flux remover (optional, as T3 SMT solder Sn63Pb37 has low residue).

Why Choose T3 SMT Solder 63/37 for Your PCB Projects?

• Consistent Performance – The SMT solder 63/37 T3 ensures reliable joints with minimal defects.

• Wide Compatibility – Works with various PCB substrates and component types.

• Long Shelf Life – Proper storage maintains solder paste usability for up to 6 months.

Conclusion

For professionals seeking a high-performance SMT solder for PCB printing, the T3 SMT Paste Solder 63/37 Sn63Pb37 500g/bottle is an excellent choice. Its eutectic Sn63Pb37 alloy ensures strong, defect-free solder joints, while the T3 particle size guarantees precision in fine-pitch applications.

Whether you're in prototyping or mass production, this SMT paste solder delivers reliability, efficiency, and superior soldering results. Order yours today and experience the difference in your PCB assembly process!

Contact Information:

Email: xfsolder@163.com or xfsolder@gmail.com
WhatsApp/Wechat: +8613450770997