T3 Tin-Lead Solder Paste 60/40 is a high-quality soldering material specially designed for BGA (Ball Grid Array) soldering. BGA technology has become one of the mainstream technologies in modern electronic manufacturing, and high-quality soldering materials are crucial to achieving reliable BGA soldering. Read More

We are a professional Chinese manufacturer of Type 3 T3 Solder Paste And Type T4 Solder Paste in both lead free alloys or lead containing alloys, such as SAC305 (Sn96.5Ag3Cu0.5), SAC0307 (Sn99Ag0.3Cu0.7), SAC07 (Sn99.3Cu0.7), Sn63Pb37 (63 37), Sn60Pb40 (60/40) or Sn62Pb36Ag2 and Sn62.8Pb36.8Ag0.4. Type 3 power size is 25-45μm and type 4 power size is 20-38μm Read More