You are here: Home » News

BGA Paste

These are related to the BGA Paste news, in which you can learn about the latest trends in BGA Paste and related information industry, to help you better understand and expand BGA Paste market.
  • T3 BGA Tin Lead Solder Paste 60 40
    T3 Tin-Lead Solder Paste 60/40 is a high-quality soldering material specially designed for BGA (Ball Grid Array) soldering. BGA technology has become one of the mainstream technologies in modern electronic manufacturing, and high-quality soldering materials are crucial to achieving reliable BGA soldering. Read More
CONTACT US
Email: xfsolder@163.com
Tel: 008613450770997
GET IN TOUCH
Copyright © 2014 Xi Feng Tin Products Co., Ltd | Support By leadong | Sitemap