Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount of Printed Circuit Boards from China We are a manufacturer of Lead-Free Solder Paste Sn96.5/Ag3/Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) for Surface Mount of Printed Circuit Boards from China. The tin content (96.5%) provides excellent melting characteristics, while the 3% silver enhances mechanical strength and solder joint reliability. Copper (0.5%) further stabilizes the alloy and contributes to improved thermal and mechanical properties, ensuring that it meets the demands of printed circuit board assembly by surface mount.
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注: 建议图片大小150px*50px 
