RoHS Compliant Lead Free SAC305 Solder Paste is a high-performance solder material designed for IC reballing. In modern electronics manufacturing, IC reballing is an important process used to repair or update the soldering connections of chips. Read More

SAC305 Solder is a lead-free tin alloy composed of tin (Sn), silver (Ag) and copper (Cu), with a chemical composition of 96.5% tin, 3.0% silver and 0.5% copper. SAC305 Solder mainly has three product forms: Solder Wire, Solder Paste and Solder Bar, each with its own characteristics and uses. Read More