Our 50/50 Tin-Lead Solder Paste offers a perfect balance of performance and reliability for SMD assembly. Whether you're looking for superior wettability, strong joint formation, or dependable conductivity, this product is your trusted partner in achieving top-tier results in electronics manufacturing. Read More

We are a manufacturer of Solder Paste with 63% Tin and 37% Lead (Type 3 and Type 4) for SMD Assembly from China. The composition is eutectic, meaning it has a melting point of around 183°C, melting and solidifying at a single temperature. This property ensures reliable solder joints, critical for high-quality electronics. Read More