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In the demanding world of electronics manufacturing, the choice of soldering material directly impacts joint integrity, production efficiency, and long-term reliability. Among the myriad of alloys available, Lead Solder Sn10Pb90 (also designated as Pb90Sn10 or simply Sn10) stands out as a specialized solution for high-temperature applications and component tinning. This high-lead alloy, containing approximately 10% tin and 90% lead, offers unique melting characteristics that make it indispensable for certain PCB THT (Through-Hole Technology) processes and step-soldering operations.
Our Lead Solder Sn10Pb90 is precision-engineered with a robust flux core, ensuring consistent wetting and superior oxide removal during soldering. Supplied in convenient reel formats of 100g, 400g, and 800g, with diameter options of 0.8mm and 1.0mm, this product is tailored to meet the rigorous demands of both manual soldering and automated wave soldering lines. Whether you are a contract manufacturer, a repair technician, or a prototyping engineer, understanding the nuances of Lead Solder Pb90Sn10 is critical to achieving defect-free assemblies.
The designation Lead Solder Sn10Pb90 reveals its fundamental composition: 10% Tin (Sn) and 90% Lead (Pb). This ratio is not arbitrary. The high lead content elevates the melting point significantly compared to standard eutectic solders like Sn63Pb37. While common lead-based solders melt around 183°C, Lead Solder Sn10 exhibits a solidus temperature of approximately 268°C and a liquidus temperature near 302°C. This broader melting range and higher operating temperature make Lead Solder Pb90Sn10 the alloy of choice for applications where components must withstand subsequent high-temperature processes.
This alloy is often referred to interchangeably as Lead Solder Sn10Pb90, Pb90Sn10, or simply Sn10. It is important to recognize that these terms describe the same material, ensuring compatibility with various international standards and datasheets. The high lead content provides excellent ductility and thermal fatigue resistance, which are vital for components subjected to thermal cycling, such as power semiconductors and ceramic substrates.
Lead Solder Pb90Sn10 is specifically formulated to prevent re-melting of previously soldered joints during subsequent assembly steps. In a typical PCB THT assembly process, you may have multiple soldering operations. For instance, when mounting components on both sides of a board, the first side is soldered using a high-temperature alloy like Lead Solder Sn10Pb90, ensuring that the joints on that side remain solid when the second side is wave soldered at lower temperatures.
Key applications for Lead Solder for PCB THT in this context include:
Tinning of component leads and terminations.
Soldering of heat-sensitive power transistors and diodes.
Attachment of connectors and switches that endure mechanical stress.
Step-soldering where thermal hierarchy is essential.
Sealing of hybrid circuits and ceramic packages.
Without the thermal stability provided by Lead Solder Sn10Pb90, your assembled PCBs risk joint collapse, component misalignment, and costly rework. The 90% lead content provides the slump resistance necessary for maintaining joint shape and strength under thermal duress.
Every reel of Lead Solder with Flux Core integrates a carefully formulated flux within the hollow center of the solder wire. As the wire melts during soldering, the flux is released directly at the point of the joint. This targeted delivery is more effective than applying liquid flux separately because it ensures that the flux is active exactly when and where it is needed – during the critical wetting phase.
The flux in our Lead Solder Sn10Pb90 serves three primary functions:
Oxide Removal: The high tin content of 10% still requires aggressive oxide breaking. Our flux eliminates oxides from both the component lead and the PCB pad, allowing the molten alloy to wet surfaces thoroughly.
Surface Tension Reduction: By reducing the surface tension of the molten Lead Solder Sn10, the flux promotes spreading, filling through-holes completely and forming a concave fillet that is mechanically robust.
Protection Against Re-Oxidation: During the heating cycle, the flux creates a protective blanket over the molten solder, preventing atmospheric oxygen from forming new oxides before the joint solidifies.
Depending on your cleanliness requirements and post-soldering processes, Lead Solder with Flux Core can be classified into three categories – Rosin (R), Mildly Activated Rosin (RMA), and Activated Rosin (RA). For most PCB THT applications, RMA flux is the standard choice due to its balance of activity and residue corrosivity. Our Lead Solder Sn10Pb90 is supplied with a halogen-free, no-clean or water-washable flux core upon request, allowing seamless integration into modern manufacturing lines where ionic contamination is strictly controlled.
The Lead Solder Sn10 100g reel is the perfect entry point for laboratories, repair stations, and small-batch production. This compact size is easy to handle, store, and feed into handheld soldering irons or semi-automatic feeders. With 100 grams of alloy, you have sufficient material to complete dozens of through-hole joints on a complex board. The lightweight reel ensures that the wire pays off smoothly without tangling, reducing operator fatigue during manual soldering.
For field service technicians who need to carry a reliable high-temperature solder, the Lead Solder Sn10 100g format is the most portable option. It fits neatly into toolkits and is compliant with most carry-on weight restrictions, making it a practical choice for on-site maintenance of industrial electronics.
When moving to medium-scale manufacturing, the Lead Solder Sn10 400g reel represents the most cost-effective balance between material volume and handling convenience. This is the most commonly ordered format for job shops and assembly houses that run multiple shift operations. The 400g reel provides a continuous feed length that minimizes splice interruptions, ensuring consistent wire diameter and flux distribution throughout the entire reel.
The Lead Solder Sn10 400g size is also compatible with most automatic solder feeders and robotic soldering systems. The reel hub and winding tension are precisely controlled to prevent backlash and ensure reliable feeding at high speeds – a critical factor for maintaining soldering cycle times in PCB THT production.
For high-throughput manufacturing environments, the Lead Solder Sn10 800g reel offers the lowest cost per gram. This bulk format reduces reel changeover frequency, thereby increasing machine uptime and overall equipment effectiveness (OEE). Large assembly lines for consumer electronics, automotive modules, and power supplies often prefer the Lead Solder Sn10 800g because it sustains long production runs without operator intervention.
Additionally, the 800g reel comes with a sturdy spool design that resists deformation during shipping and storage. This ensures that the wire maintains its original roundness and concentric flux core alignment – essential parameters for consistent solder deposit volume and repeatable wetting performance.
The Lead Solder Sn10 0.8mm diameter is the preferred choice for dense PCB THT assemblies where component leads are closely spaced and pad diameters are small. A thinner wire allows for more precise control over the amount of solder delivered to each joint, reducing the risk of bridging between adjacent pins. This is particularly important when soldering DIP packages, headers, and connectors with a 2.54mm pitch or smaller.
The Lead Solder Sn10 0.8mm is also beneficial for drag soldering and manual touch-up, as the lower volume per unit length means the operator can apply incremental amounts of solder without overheating the board or damaging nearby heat-sensitive components. The flux-to-alloy ratio is maintained precisely in this diameter, so you do not lose the cleaning benefits despite the reduced cross-section.
When working with heavy-duty components such as transformers, relay bases, battery terminals, and thick gauge wire, the Lead Solder Sn10 1.0mm diameter provides the necessary solder volume to fill large plated through-holes. A 1.0mm wire delivers more alloy per millimeter, allowing faster deposition and reducing soldering time. This is particularly important for components with high thermal mass that tend to sink heat away from the joint – the higher feed rate of the 1.0mm diameter ensures that the joint reaches temperature quickly and maintains wetting before the flux expires.
For wave soldering and selective soldering processes, Lead Solder Sn10 1.0mm is often used as a standard due to its compatibility with common pump nozzles and wire guides. The thicker wire is also less prone to buckling during automatic feeding, ensuring a steady and reliable process.
Achieving optimal results with Lead Solder for PCB THT requires adherence to specific process parameters due to the high melting point of Sn10Pb90.
Preheating: Since Lead Solder Sn10Pb90 melts above 300°C, preheating the PCB and components to 100–130°C reduces the thermal shock and ensures the flux is fully activated before the solder melts.
Soldering Iron Temperature: Set your iron tip to 360–400°C for manual soldering. A tip with sufficient thermal mass is necessary to maintain temperature during the brief contact time. The higher temperature accelerates flux activation and ensures rapid wetting.
Dwell Time: Keep the iron contact time between 2–4 seconds. Prolonged dwell can degrade the flux and cause excessive intermetallic growth, compromising joint strength.
Tip Maintenance: The high lead content of Lead Solder Pb90Sn10 tends to oxidize tip surfaces faster. Use a tip cleaner and replenish with fresh solder regularly to maintain heat transfer efficiency.
Lead Solder Sn10Pb90 exhibits excellent compatibility with OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and HASL (Hot Air Solder Leveled) finishes. The active flux core breaks through organic coatings readily, making it a versatile choice for mixed-technology boards. When soldering onto palladium or silver finishes, be mindful of dissolution rates – the high temperature accelerates metal dissolution, so optimizing temperature and dwell is crucial.
The flux core in Lead Solder with Flux Core is susceptible to moisture absorption and flux migration if stored improperly. To maximize the shelf life of your Lead Solder Sn10Pb90 reels, adhere to the following guidelines:
Store in a cool, dry environment with relative humidity below 60%.
Keep the reels in their original sealed packaging until ready for use.
Avoid prolonged exposure to direct sunlight or extreme temperature fluctuations.
Use a desiccant cabinet for long-term storage of partially used reels.
Under recommended conditions, the shelf life of Lead Solder Sn10Pb90 exceeds 24 months without significant degradation in wetting or flux activity.
It is important to note that Lead Solder Pb90Sn10 contains lead, which is restricted under the RoHS directive for most consumer electronics. However, this alloy benefits from explicit exemptions under RoHS Annex III for high-temperature soldering applications, specifically where solders with a melting point above 250°C are required. Therefore, Lead Solder Sn10Pb90 remains fully legal and compliant for use in:
Server and networking equipment.
Industrial control systems.
Medical devices (certain categories).
Military and aerospace electronics.
Automotive under-the-hood sensors and power modules.
Our Lead Solder Sn10Pb90 is supplied with a certificate of compliance that details the exemption category applicable to your specific order.
When handling Lead Solder Sn10, it is mandatory to follow occupational health guidelines. Employ local exhaust ventilation to capture fumes generated during soldering. Although the flux fumes are the primary irritant, lead particulates can also be emitted. Use fume extractors with HEPA and activated carbon filters. Always wash hands after handling the wire, and avoid eating or drinking in the work area. Dispose of dross and used solder according to local environmental regulations for lead-bearing waste.
We offer Lead Solder Sn10Pb90 in the following standard configurations:
| Product Code | Alloy | Flux Core | Weight | Diameter |
|---|---|---|---|---|
| LS-1090-100-8 | Sn10Pb90 | RMA | 100g | 0.8mm |
| LS-1090-100-10 | Sn10Pb90 | RMA | 100g | 1.0mm |
| LS-1090-400-8 | Sn10Pb90 | RMA | 400g | 0.8mm |
| LS-1090-400-10 | Sn10Pb90 | RMA | 400g | 1.0mm |
| LS-1090-800-8 | Sn10Pb90 | RMA | 800g | 0.8mm |
| LS-1090-800-10 | Sn10Pb90 | RMA | 800g | 1.0mm |
All reels are wound on standard plastic spools with clearly labeled weight and diameter markings for easy identification on the production floor.
For high-volume users, we provide custom packaging options including bulk boxes, multiple reels per carton, and private labeling. You can choose between RMA, RA, or no-clean flux formulations. Additionally, we can adjust the flux percentage (typically 2.2% to 3.5% by weight) to suit your specific soldering profile. Minimum order quantities for custom configurations start at 50 kg. Contact our technical sales team to discuss your Lead Solder Sn10Pb90 requirements.
Every batch of Lead Solder Sn10Pb90 undergoes rigorous incoming inspection to verify composition, flux content, and diameter tolerance. Using X-ray fluorescence (XRF) and inductively coupled plasma (ICP) spectroscopy, we ensure that the tin content is within ±0.5% of the nominal 10% specification. The lead balance is adjusted to compensate for any deviations, guaranteeing that the melting characteristics remain consistent from reel to reel.
Our production facility for Lead Solder with Flux Core is ISO 9001 and IATF 16949 certified. The wire drawing process includes multiple cold-drawing stages with intermediate annealing to achieve the precise 0.8mm and 1.0mm diameters. The flux core is injected using a co-extrusion process that centers the flux perfectly, preventing "flux offset," which could lead to uneven wetting. Each reel is electronically weighed and seal-packaged in vacuum bags to prevent oxidation during transport.
Every reel of Lead Solder Sn10Pb90 carries a unique lot number and date code. This enables full traceability from raw ingot to finished product. In the event of a quality query, we can provide spectrographic analysis reports, flux activity tests, and spiral flow test results for the specific lot. This level of documentation is particularly critical for PCB THT applications in automotive and defense sectors, where strict quality archives are mandatory.
The solidus temperature is 268°C and the liquidus temperature is 302°C. The plastic range between these two temperatures allows for good gap-filling characteristics in PCB THT plated holes.
While primarily intended for through-hole and component tinning, Lead Solder Sn10Pb90 can be used for surface mount applications only if the components and boards are rated for the high soldering temperature. Consult the component data sheet before attempting SMT with this alloy.
The cost is driven by the higher lead content, which is increasingly subject to supply chain restrictions and mining controls. Additionally, the flux formulation for high-temperature use is more complex and expensive to produce.
Our RMA flux residues are designed to be inert and may be left on the board for most commercial applications. For stringent cleanliness requirements, use a saponifier solution followed by deionized water rinse, or a blend of isopropyl alcohol and deionized water for manual cleaning.
Yes, we can supply diameters from 0.5mm to 2.0mm on special request. Please note that larger diameters are less common for Lead Solder Sn10 due to the higher feed rate and thermal challenges.
Selecting the correct soldering material is a strategic decision that affects yield, reliability, and total cost of ownership. Our Lead Solder Sn10Pb90 offers a proven track record in high-temperature electronics assembly, backed by tight process controls, multiple weight and diameter options, and a flux core engineered for modern lead-free-compatible finishes.
Whether you need the portability of Lead Solder Sn10 100g for laboratory evaluation, the productivity of Lead Solder Sn10 400g for your assembly line, or the economic advantages of Lead Solder Sn10 800g for mass production, our reel configurations are designed to minimize waste and maximize efficiency. Pair that with the flexibility of Lead Solder Sn10 0.8mm for dense boards or Lead Solder Sn10 1.0mm for heavy components, and you have a comprehensive solution for all PCB THT welding requirements.
Beyond the product specifications, we stand behind every reel with technical support, failure analysis assistance, and process optimization consulting. Our team of metallurgists and process engineers is ready to assist you in fine-tuning your soldering profile to extract the best possible performance from Lead Solder Pb90Sn10.
Order your Lead Solder Sn10Pb90 reels today and experience the difference that precision-engineered soldering materials make to your product reliability. For bulk quotes, custom flux formulations, or just-in-time delivery schedules, please reach out to our dedicated sales team. We ship globally with full customs documentation, ensuring that your Lead Solder with Flux Core arrives on time and in perfect condition.
Contact us:
Email: xfsolder@163.com or xfsolder@gmail.com
WhatsApp/Wechat: +8613450770997
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