Views: 0 Author: Site Editor Publish Time: 2025-05-14 Origin: Site
In the world of electronics manufacturing, the quality of solder directly impacts the durability and performance of electronic components. Lead free tin solder has become the industry standard due to its environmental safety and compliance with global regulations such as RoHS and REACH. Among the various options available, tin solder Sn99Ag0.3Cu0.7 stands out as a premium choice for professionals seeking reliability, excellent conductivity, and strong mechanical bonds.
This core wire solder is engineered with precision, ensuring smooth application, minimal spattering, and superior wetting properties. Whether you are working on PCB assembly, automotive electronics, or consumer devices, 1.5mm lead free tin solder provides the perfect balance of thickness and flexibility for both manual and automated soldering processes.
The lead free tin solder Sn99Ag0.3Cu0.7 is composed of 99% tin (Sn), 0.3% silver (Ag), and 0.7% copper (Cu). This alloy offers:
Excellent electrical conductivity – Ensures stable signal transmission in circuits.
High mechanical strength – Reduces the risk of joint failure under stress.
Low melting point (217-227°C) – Allows for efficient soldering without damaging sensitive components.
Compared to traditional lead-based solders, this tin solder Sn99Ag0.3Cu0.7 provides a safer and more sustainable alternative without compromising performance.
With increasing environmental regulations, manufacturers must transition to lead free tin solder solutions. Our Sn99Ag0.3Cu0.7 alloy is fully compliant with:
RoHS Directive – Free from hazardous substances like lead and cadmium.
REACH Standards – Safe for workers and end-users.
WEEE Compliance – Easier recycling and disposal.
By choosing this core wire solder, you contribute to a greener electronics industry while maintaining high-quality production standards.
The 1.5mm lead free tin solder features a high-purity flux core (typically no-clean or rosin-based) that ensures:
Excellent wetting ability – Promotes strong adhesion to copper, silver, and gold surfaces.
Low spatter – Reduces waste and cleanup time.
Minimal flux residue – Ideal for applications where post-soldering cleaning is not feasible.
This makes it perfect for intricate PCB work, SMT components, and fine-pitch soldering tasks.
This versatile lead free tin solder is widely used in:
Smartphones, tablets, and laptops
LED lighting systems
Home appliances
Engine control units (ECUs)
Sensor modules
Infotainment systems
Control boards for machinery
Diagnostic equipment
High-reliability circuit assemblies
Circuit board repairs
Hobbyist electronics projects
Prototyping and R&D
Diameter: 1.5mm – Ideal for precision soldering.
Flux Content: 2% (adjustable upon request).
Spool Size: Standard 500g or 1kg reels (custom options available).
Shelf Life: Up to 2 years when stored in a dry, cool environment.
Consistent Quality – Manufactured under strict quality control to ensure uniform melting and bonding.
Wide Compatibility – Works with most soldering irons, reflow ovens, and wave soldering machines.
Cost-Effective – Reduces rework and improves production efficiency.
Trusted by Professionals – Used by leading electronics manufacturers worldwide.
For engineers, technicians, and manufacturers seeking a high-performance lead free tin solder, the tin solder Sn99Ag0.3Cu0.7 is an unbeatable option. Its superior alloy composition, environmental compliance, and ease of use make it the go-to core wire solder for modern electronics assembly.
Whether you need 1.5mm lead free tin solder for delicate PCB work or high-volume production, this product delivers reliability, efficiency, and outstanding results.
Upgrade your soldering process today with Sn99Ag0.3Cu0.7 – the smart, sustainable choice for lead-free electronics manufacturing!
Contact Information:
Email: xfsolder@gmail.com or xfsolder@163.com
WhatsApp / Wechat: 008613450770997
注: 建议图片大小150px*50px 
